The ‘Apple of China’ will unveil its first in-house developed SoCs next week at an event in Beijing. Ahead of the announcement, core specifications of the first Pinecone chips have been leaked on the web.
At the event, Xiaomi is reportedly working on two SoCs – V670 and the V970. The V670 is likely to be the one that will be announced next week. It features a total of eight cores, four high-frequency ARM Cortex-A53 cores and four ARM Cortex-A53 low-power cores. The processing cores will be integrated with an ARM Mali-T860 MP2 GPU to take care of graphics processing. The chipset is going to be manufactured on a 28nm process node.
The V970 on the other hand is said to be a more powerful SoC targeted at mid-range smartphones. It too is going to be an octa-core chip with four ARM Cortex-A73 cores and four ARM Cortex-A53 cores. The chipset will integrate a Mali G71 MP12 GPU for handling graphics duties. Xiaomi is apparently working with Samsung to manufacture the V970 chipset on its 10nm node.
While the V670 is expected to show up in a Xiaomi smartphone very soon, the more powerful V970 will not be making an appearance until the end of the year. Depending on how things turn out, we wouldn’t be surprised if the first Xiaomi smartphone with the V970 comes out early next year.