The next Xiaomi flagship smartphone is scheduled to be revealed by the company at its event in Beijing scheduled for January 15th. However, thanks to the folks at Noweherelese.fr, we have managed to get our first glimpse of the Xiaomi Mi5’s ultra-thin body.
In our report yesterday, we told you that the company is claiming that its next flagship is going to be as thin as the wings of the Cicada insect. Well, it looks like the claim may not have been too much of an exaggeration as Noweherelese.fr claims that the Mi5 is going to be as thin as 5.1mm. That is quite an impressive feat, and significantly thinner than current thinnest flagship smartphones from Huawei and Apple that are between 6 to 7mm thin. The smartphone is reported have a height of 140.89mm and 71.4mm width. Earlier rumors about the Mi5 claimed that the device will come with a 5.7” display, but these dimensions point towards a display size no larger than 5.2 or 5.3”. The Nowehreelse.fr report confirmed the Quad HD resolution of the smartphone but doesn’t seem to have any concrete details on the exact screen size of the smartphone.
The leaked picture released by the website shows a metal unibody design, which makes the 5.1mm thin profile seem even more impressive. They have also posted pictures of a Mi5 silicon case, likely manufactured by a third party for the smartphone. The Mi5 is expected to be powered by the Qualcomm Snapdragon 805 or 810 chipset. The amount of RAM is expected to be 3GB, although 4GB is also possible. It will also reportedly arrive with a 16 or 20MP rear camera, and an 8MP front-facing camera for selfies. With just under a week left for the official announcement, we don’t need to wait much longer to find out the rest of the details.