Xiaomi has sent out press invites to its event on January 15th where the company will be announcing its latest flagship smartphone. The event will be held at the National Conference Center in Beijing. The press invite teases the ultra-thin profile of the smartphone, expected to be one of the thinnest flagship smartphones yet.
In the official teaser page on Miui forums, the Xiaomi representative claims that the device is going to be as thin as the cicada insect’s wings. Now, that isn’t possible obviously but it does indicate that the device could be sub-6mm thin, or perhaps even as thin as 5mm. If the next Xiaomi flagship is indeed that thin, it is certainly going to be extremely impressive as the device will pack powerful internals as well, unlike some of the other devices that are around 5-6mm thin.
Apart from its purported insect-wings-thin profile, the Mi5 is going to impress with its hardware as well. The smartphone is rumored to arrive with a 5.7-inch Quad HD display, Qualcomm Snapdragon 805 or 810 chipset, 20MP rear camera, and a fingerprint sensor built in to the home button. It is expected to feature razor-thin bezels that could give the LG G3 a run for its money. Along with the specs, the Xiaomi Mi5 or Mi4s is also going to be an important device because it is going to be the first Xiaomi flagship smartphone that will be offered in the US and European markets as well. So far Xiaomi has had a limited presence only in the Asian markets. The company managed to become the world’s third biggest smartphone maker last year, so an expansion into the western markets is quite likely to help it reach closer to the second spot this year. However, it does remain to be seen if Xiaomi will be able to strike a deal with any of the major US carriers to sell its flagship smartphone in the US market.