TSMC has announced that it is on schedule to begin production on the 7nm manufacturing process by 2018, with the eventual push to 5nm said to occur by 2020. The vendor will leverage extreme ultraviolet (EUV) lithography to produce at 5nm, according to co-CEO Mark Liu:
We’ve made significant progress with EUV to prepare for its insertion, likely in 5nm.
TSMC is also targeting a higher chunk of the market after netting a 40 percent market share in the 14/16nm segment in 2015. The foundry is setting its sights on grabbing over 70 percent of the share in this segment, which will be aided by the launch of its 16nm FinFET Compact node later this quarter.
The 16nm segment is said to account for 20 percent of the vendor’s overall revenues for this year.