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Samsung starts mass production of 4GB HBM2 memory stacks


Samsung today announced it has started mass producing the industry’s first 4 gigabyte (GB) DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface.

The new HBM2 DRAM package will be used in upcoming high performance computing (HPC), advanced graphics, network systems, as well as enterprise servers. Both AMD and NVIDIA are rumored to be using HBM2 memory on their next-gen GPU architectures expected to debut this year.

Samsung claims its new HBM2 solution offers seven times faster performance than the current DRAM performance limit, while offering improved energy efficiency as well. The 4GB HBM2 DRAM is manufactured on Samsung’s most efficient 20-nm process technology and utilizes advanced HBM chip design. It features 256GBps bandwidth, which is twice as high as a HBM1 DRAM package.

More crucially, Samsung also announced that it plans to produce 8GB HBM2 DRAM package later this year, intended for graphics cards. The 8GB HBM2 DRAM will allow graphics cards to enjoy significant space savings of more than 95 percent when compared to GDDR5 DRAM, allowing for more compact form factors.

Source: Samsung Newsroom

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