Oppo today confirmed its upcoming R7 smartphone will feature a metal unibody design as it tweeted a teaser image of the smartphone on its Weibo page.
The R7 had passed through TENAA (the Chinese certification agency) yesterday and from the listing some of the device’s specifications were revealed. While earlier rumors were claiming the smartphone would be the thinnest smartphone in the world with a sub 4.75mm body, the TENAA listing points to a 6.3mm body. That’s quite far off the 4.85mm profile of the Oppo R5 and the 4.75mm thin profile of the Vivo X5 Max.
For the Chinese market, the Oppo R7 will be available in two variants. The China Telecom variant will be powered by a 64-bit Qualcomm Snapdragon 616 octa-core chipset clocked at 1.5 GHz while the China Mobile variant of the smartphone will be powered by a MediaTek octa-core 1.7GHz MT6752 chipset.
The Oppo R7 is expected to be announced in China on May 20th and should be available in the Chinese market soon after the announcement. It will most likely be launched in other Asian markets as well, although no details are available currently.