At the Mobile World Congress 2017 in Barcelona, MediaTek has announced that its latest flagship mobile SoC – Helio X30, is going to show up inside mobile devices in the second quarter of the year. With the Helio X30, MediaTek is aiming to take on Qualcomm’s Snapdragon 835 and Samsung’s Exynos 9 8895 octa-core SoCs.
Like the Helio X20 and X25 SoCs, the new Helio X30 is also a deca-core chipset using a tri-cluster configuration. There are two ARM Cortex-A72 cores clocked at 2.5 GHz, four ARM Cortex-A53 cores clocked at 2.2 GHz, and four ARM Cortex-A53 cores clocked at 1.9 GHz. To handle graphics, the chipset integrates a PowerVR 7XTP-MT4 GPU clocked at 800 MHz.
The Helio X30 also adds support for quad-channel LPDDR4 RAM, dual 16MP cameras, and LTE Cat.10 connectivity with maximum download speeds of up to 450 Mbps. It is expected to be a significant improvement over the previous Helio X20 and X25 chips in terms of efficiency as well, thanks to it being manufactured on a 10nm FinFET process by TSMC. MediaTek in fact claims the Helio X30 draws 50% less power than the X20 when running an unspecified CPU workload and up to 60% less when running GFXBench T-Rex. This should mean smartphones powered by the Helio X30 will be able to deliver better battery life and won’t suffer from any major thermal throttling issues.
As of now, the new flagship SoC from MediaTek doesn’t boast of many design wins. In fact, the company expects less than ten mobile devices to be powered by the Helio X30 chipset.