In collaboration with Infineon Technologies AG, a German technological firm, LG Electronics has announced the development of the in-facing Time-of-Flight cameras on its upcoming flagship LG G8 ThinQ smartphone. The device is slated to be unveiled in Barcelona during Mobile World Congress 2019.
With Infineon’s REAL3 image sensor chip, the LG G8 ThinQ is able to better sense depth information on the front-facing selfie cameras for biometric authentication, virtual reality (VR) and augmented reality (AR) applications, and in portrait mode selfies.
The technology processes data points generated by infrared reflections to provide an accurate depth map. This translates into power savings as compared to more demanding conventional 3D technologies that involve heavy processing to calculate distance to objects.
Another advantage ToF technology holds over its conventional competition its consistent performance in a variety of lighting conditions, delivering a good recognition rate in facial recognition applications and in VR and AR scenarios.
We can also expect the ToF technology to feature on premium, and mid-to-high-end devices.