After shedding light on Intel’s Coffee Lake architecture, the guys over at Chinese website Benchlife.info are back with a new leak. This time, they have accessed a slide that details Intel’s 200-series platform, which is expected to debut early next year. The Z270 chipset will be aimed at the consumer market, while the H270 series will be aimed at the corporate segment.
The latest leak confirms that the Intel 200-series chipsets will be compatible with both the 7th Generation Kaby Lake processors as well as the existing 6th Generation Skylake processor family. So if you have an Intel Skylake chip, you will be able to use it with a new 200-series motherboard next year.
While the Z270 and Z170 chipsets are similar in most respects, the Z270 will have a few added advantages. These include support for newer Rapid Storage Technology v15, up to 30 maximum high speed I/O (HSIO) lanes as opposed to 26 with Z170, and up to 24 Max PCIe Express 3.0 lanes. Similarly, H270 too is going to have support for Intel Rapid Storage Technology v15, up to 30 maximum high speed I/O (HSIO) lanes, and up to 20 Max PCIe Express 3.0 lanes. Both the Z270 and H270 chipsets will come with support for Intel Optane technology, which is not available on the 100-series chipsets. Overclocking support will only be available on the Z270 chipset and not on the H270. Multi-GPU support too will only be offered with the Z270 chipset.
Intel is expected to officially launch the Kaby Lake desktop processor family on January 5th 2017.