Chinese website Benchlife.info has accessed two internal Intel slides that reveal some key information about Intel’s X-series “Basin Falls” platform, comprising of Skylake-X and Kaby Lake-X HEDT processors, and a chipset largely based on the upcoming Intel 200-series. The “Basin Falls” platform will succeed the current Broadwell-E LGA2011v3 lineup. Both Skylake-X and Kaby Lake-X are likely to be manufactured on a newer 14nm+ node as opposed to the first-gen 14nm node used for Skylake-S.
The Skylake-X lineup will comprise of six-, eight-, and 10-core processors, while the Kaby Lake-X lineup will comprise mainly of only quad-core processors initially. According to the leaked slides, the Skylake-X processors will feature 13.75MB LL cache, up to 44 PCI-Express gen 3.0 lanes, Turbo Boost 3.0, support for up to DDR4-2666 (1 D/Ch), and a maximum TDP of up to 140W. The Kaby Lake-X processors on the other hand will come with 8MB of LL cache, up to 16 PCI-Express gen 3.0 lanes, Turbo Boost 2.0, DDR4-2666 (1 D/Ch) memory support, and a TDP of up to 112W. With up to 44 PCI-E 3.0 lanes, Skylake-X will easily support multiple graphics cards, PCI-Express based NVMe SSD drives, and Thunderbolt controllers.
Intel is expected to launch the Skylake-X HEDT processors in the third quarter of 2017, with Kaby Lake-X expected to be launched shortly after.