The latest leak brings information on the device’s processor and dimensions.
Rumors about HTC’s next flagship, allegedly codenamed Hima, have been swirling around the internet for a few weeks now, and it seems those rumors have no intention of dying down anytime soon. More details about the Hima have been leaked by upleaks, this time focusing on the processor ticking away inside and the phone’s dimensions.
According to upleaks, the HTC Hima will indeed be powered by the octa-core Snapdragon 810 processor, clocked at 2GHz for the high-performance cores and at 1.5GHz for the low-power cores. The choice of processor here isn’t surprising, as the Snapdragon 810 is all set to become the SoC of choice for flagship devices in 2015. Also revealed in the new leak are the dimensions of the Hima – the phone will reportedly measure 144.3 x 69.4 x 9.56 mm. That makes it a tad smaller than the HTC One M8, a good hint that HTC will be sticking to a 5-inch display (or less) instead of going bigger like the competition.
Previously rumored specs of the Hima include 3GB of RAM, a 20.7-megapixel rear camera, a 13/4-megapixel UltraPixel front-facing camera, 1080p display resolution, and a 2,840mAh battery. The phone is expected to be available in Gray, Silver, Gold and Gunmetal Gold, run Android 5.0 Lollipop with HTC’s Sense 7 UI, and will be accompanied by accessories like Active Headset, DotView, DecoStand Case, and Clear Case when it launches in the first quarter next year.