According to a new leak coming from Benchlife, Intel has delayed the release of its 7000-series Skylake-X and Kaby Lake-X HEDT lineup to August. Both Skylake-X and Kaby Lake-X will reportedly be announced at Gamescom 2017 in Cologne, Germany. The leak also claims that Intel has modified the cache size to offer
The initial lineup is expected to comprise of only four SKUs, all of which will be manufactured on a 14nm process node. The 10-core, 8-core, and 6-core SKUs will be based on the Skylake architecture, while the 4-core SKU is going to be based on the Kaby Lake architecture. In terms of the TDP, the Skylake-based SKUs are expected to have a 140W TDP rating while the Kaby Lake-X chip will have a 112W TDP rating.
All of the chips have been designed to work on the flagship Intel X299 platform, which is going to use the LGA 2066 socket. The upcoming X299 chipset will offer up to 24 PCIe 3.0 lanes, quad-channel memory support up to DDR4-2667 MHz, Intel Optane, 10 USB 3.0, 8 USB 2.0, SATA 3.0 ports. While the Skylake-X and Kaby Lake-X processors will only be launched in August, new motherboards based on the Intel X299 chipset are expected to be shown off at Computex 2017 in June.
Intel Skylake-X and Kaby Lake-X lineup will be taking on AMD’s enthusiast Ryzen family, expected to be released by the end of the current quarter.