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Intel & Micron Build Wafer Fab In Singapore

Intel and Micron intend to form a joint venture in Singapore to build and manage a NAND flash wafer fab that will come online in the second half of 2008. The fab would initially use a 50-nm process technology on 300-mm wafers. The Singapore JV s facility is expected to break ground in the first half of 2007. Micron already has a joint venture in Singapore — with Hewlett Packard, Canon and the Singapore Economic Development Board — for the production of DRAMs.

Intel and Micron intend to form a joint venture in Singapore to build and manage a NAND flash wafer fab that will come online in the second half of 2008. The fab would initially use a 50-nm process technology on 300-mm wafers. The Singapore JV s facility is expected to break ground in the first half of 2007. Micron already has a joint venture in Singapore — with Hewlett Packard, Canon and the Singapore Economic Development Board — for the production of DRAMs.

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