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Hynix DDR2 Mass Production In Q1 2004

Hynix Semiconductor plans to begin mass production of double data rate 2, or DDR2, chips in the first quarter of 2004, using a finer 0.11 micron processing technology. A finer processing technology allows more chips to be produced from a wafer, boosting output and cutting production costs. Hynix, which makes dynamic random access memory, or DRAM, chips most widely used in personal computers, said it has received approval from Intel for its 512-megabit DDR2 SDRAM chips to be used with Intel’s microprocessors. “We expect demand for DDR2 to surge in 2004 as PC makers adopt Intel’s microprocessors that are compatible with DDR2 memory chips,” Farhad Tabrizi, vice president of worldwide marketing, said in a statement.

Hynix Semiconductor plans to begin mass production of double data rate 2, or DDR2, chips in the first quarter of 2004, using a finer 0.11 micron processing technology. A finer processing technology allows more chips to be produced from a wafer, boosting output and cutting production costs. Hynix, which makes dynamic random access memory, or DRAM, chips most widely used in personal computers, said it has received approval from Intel for its 512-megabit DDR2 SDRAM chips to be used with Intel’s microprocessors. “We expect demand for DDR2 to surge in 2004 as PC makers adopt Intel’s microprocessors that are compatible with DDR2 memory chips,” Farhad Tabrizi, vice president of worldwide marketing, said in a statement.

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